Work requests can be submitted by filling the Optics Group's work request from.
The crystal optics facilities are described below.
|Dicing/Cutting Laboratory (COF2)
The lab is equipped with two dicing saws for precision cutting of wafers and plates up to 10mm thick, and a diamond-wire saw for slicing crystal boules of Si and Ge up to 8 inches in diameter and length. All slicing and cutting processes have been optimized to minimize the induced crystalline damage.
|Etching Laboratory (Bldg. 401/L0104)
This facility is used to etch crystals using wet chemical methods (mainly HF and HNO3) to remove surface layers that have stresses/strains/damages induced by machining processes.
|Polishing Lab (COF3)
The Polishing Laboratory utilizes the following lappers/polishers
|Hyprez LM28 Lapping Machine (Engis)
|Strasbaugh 6DF-1 Precision Polishmaster
This versatile overarm polisher can be outfitted with variety of plates and pads to perform intermediate and fine polishing steps, using diamond or colloidal silica slurries.
C-CHiRP 400 Channel Cut Polishing Machine
In-house developed and patented method for automated polishing of channel-cut crystal monochromators. Polishing of the inner diffracting surfaces reduces helps preserve coherence of the beam, and is critical for taking advantage of APS-U beam characteristics.
The Fabrication Laboratory is equipped with DIC microscope for immediate inspection during polishing process. Optics requiring more detailed inspection and accurate measurements are sent to the Metorology Laboratory.
|Other Equipment (in collaboration with the ANL Central Shops)
Two high-precision grinders; Blanchard precise grinder; several overarm polishers; core drill press; and Ultrasound mill.
|X-ray Laboratory (Bldg. 401/L0111 and 401/L0120)
This laboratory is equipped with three main instruments:
Advanced X-ray characterization of crystal optics is carried out at the 1-BM Optics and Detectors Test Beamline.
|Crystal Optics Research and Development
R&D in crystal optics is carried out either independently, or jointly with the APS beamline scientists and user community, or in collaboration with other facilities to keep the group at the state-of-the art in x-ray optics. Examples include designing and development of high-to ultrahigh- resolution crystal monochromators and analyzers (from sub-10 meV to sub-meV) for IXS/RIXS, strain-free crystal polishing with roughness toward 1A, automated machine polishing of channel-cut crystals, quartz-based X-ray optics, diamond optics, SiC optics, etc.
Development of novel sub-10-meV RIXS system with a flat quartz analyzer (in collaboration with IXN Group, Kim et al., Scientific Reports 8, 1598 (2018).