URL
https://www.aps.anl.gov/APS-Science-Highlight/2024-09-18/combining-the-scaffolding-and-the-chain-a-method-for-producing-one
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Scientists are exploring materials whose electronic properties could reduce the amount of resistive heating created by the transistors in computer chips. These new materials incorporate a one-dimensional electronic structure---meaning that the electrons which create current are confined to a single dimension---inside a three-dimensional crystal with insulating properties.
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