Polishing, Dearation and Makeup
of Deinoized Process Water for APS

Presentation by R. Dortwegt on June 27, 2000

Purpose of Systems
Makeup System
Process Water (PW) Polishing system
Dearation System
Dearator Pressure Summary
Issues Well Understood
Issues To Be Considered


Purpose of Systems

Block Diagram of Process Water System
Block Diagram of Treatment System

Makeup System

Process Water (PW) Polishing system

P-W Polishing System

Dearation System

Dearator Operation
Vapor Space
Dearator Vacuum System

Dearator Pressure Summary

  65 ppb
in effluent
15 ppb
in effluent
Current
<5 ppb (in effluent)
Partial pressure of water (75F)
in vapor space (torr)
22.2 22.2  
Partial pressure of oxygen
in vapor space (torr)
1.3 0.3  
Partial pressure of nitrogen
in vapor space (torr)
9.5 2.2  
Total pressure
in vapor space (torr)
33 24.7  
Observed 30-35 23-24 21-23

Original System
Dearator System

Issues Well Understood

Issues To Be Considered

High Quality Water and pH
Average Corrosion Rate of Copper
Shaft Seal-Oil & Primary Water Supply Systems
Copper hollow conductors
Water chemistry of cooling systems made from copper-based materials in the loops of power-generating units

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Please email comments or questions to dortwegt@aps.anl.gov