How Lead-Free Solder (Mis)Behaves under Stress
October 10, 2012
The reliability and longevity of electronics is critical to current telecommunications technology. Research on 6-ID-D is bringing new information about thermal fatigue in environmentally friendly, lead-free solder joints. These studies provide information for making reliability predictions about solder-joint failure in this important new material.Contact: Thomas Bieler - Michigan State University












